[ Pobierz całość w formacie PDF ]

Middle East: see Italy
For all other countries apply to: Philips Semiconductors, Internet:http://www.semiconductors.philips.com
Marketing & Sales Communications,
Building BE, P.O. Box 218, 5600 MD EINDHOVEN,
The Netherlands, Fax. +31 40 272 4825
9397 750 04878 Philips Electronics N.V. 1999. All rights reserved.
Preliminary specification 14 April 1999 11 of 12
TDA8945S
Philips Semiconductors
15 W mono BTL audio amplifier
Contents
1 General description. . . . . . . . . . . . . . . . . . 1
2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
3 Applications. . . . . . . . . . . . . . . . . . . . . . . . 1
4 Quick reference data. . . . . . . . . . . . . . . . . 1
5 Ordering information . . . . . . . . . . . . . . . . 2
5.1 Ordering options. . . . . . . . . . . . . . . . . . . . 2
6 Block diagram . . . . . . . . . . . . . . . . . . . . . . 3
7 Pinning information . . . . . . . . . . . . . . . . . 3
7.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
7.2 Pin description . . . . . . . . . . . . . . . . . . . . . 4
8 Functional description . . . . . . . . . . . . . . . 4
8.1 Power amplifier. . . . . . . . . . . . . . . . . . . . . 4
8.2 Mode selection . . . . . . . . . . . . . . . . . . . . . 4
9 Limiting values . . . . . . . . . . . . . . . . . . . . . 5
10 Thermal characteristics . . . . . . . . . . . . . . 5
11 Static characteristics . . . . . . . . . . . . . . . . 5
12 Dynamic characteristics. . . . . . . . . . . . . . 6
13 Application information . . . . . . . . . . . . . . 6
14 Test information . . . . . . . . . . . . . . . . . . . . 7
14.1 Quality information . . . . . . . . . . . . . . . . . . 7
15 Package outline. . . . . . . . . . . . . . . . . . . . . 8
16 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . 9
16.1 Introduction to soldering through-hole mount
packages . . . . . . . . . . . . . . . . . . . . . . . . . 9
16.2 Soldering by dipping or by solder wave . . 9
16.3 Manual soldering . . . . . . . . . . . . . . . . . . . 9
16.4 Package related soldering information . . . 9
17 Revision history . . . . . . . . . . . . . . . . . . . . 9
18 Data sheet status. . . . . . . . . . . . . . . . . . . 10
19 Definitions . . . . . . . . . . . . . . . . . . . . . . . . 10
20 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . 10
Philips Electronics N.V. 1999. Printed in The Netherlands
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner.
The information presented in this document does not form part of any quotation or
contract, is believed to be accurate and reliable and may be changed without notice. No
liability will be accepted by the publisher for any consequence of its use. Publication
thereof does not convey nor imply any license under patent- or other industrial or
intellectual property rights.
Date of release: 14 April 1999 Document order number: 9397 750 04878 [ Pobierz całość w formacie PDF ]

  • zanotowane.pl
  • doc.pisz.pl
  • pdf.pisz.pl
  • markom.htw.pl